Sensors and Wireless Category

TE-Connectivity-FI

Posted On September 11, 2018By Component Distributors Inc.In Ewave, Sensors and Wireless, TE Connectivity

TE Connectivity, Model 64X Accelerometer

TE Connectivity, Model 64X Accelerometer Next Generation Crash Accelerometer Advanced Piezoresistive MEMS Sensor   TE Connectivity introduces the Model 64X, the most advanced accelerometer ever released for anthropomorphic dummy instrumentation. The accelerometer features a full bridge output configuration with an advanced damping for excellent shock survivability and flat frequency response to 7kHz. The model 64X accelerometer has a standard cross-talk accuracy of <2%, a standard ZMO of <±20mV and a linearity accuracy specification of <±0.70%. The model 64X accelerometer is offered in ranges from ±200 to ±2000g and has distinctRead More
NovaSensor-FI
NPX Product End of Life (EOL)   Subject: NPX Product End of Life (EOL) From: Robert Burgess Date: 7/27/18 To Whom It May Concern, This letter is to notify you that Amphenol Advanced Sensors has been given an Allocated EOL (end of life) notification by our ASIC supplier for a critical component used in this product. Our supplier has stated they will accept orders until August 24, 2018. Therefore, we are notifying all of our customers that use this product today to make any last time purchases on or beforeRead More
FI-TDK-InvenSense
Come Talk to Qualcomm, Microsoft, Intel, Oculus, and TDK about your Development Needs     Only 10 days left for you to sign up and discuss all of your Sensor Development needs! Come personally meet leaders in the industry, and have your questions answered and find out where the future of sensor development is heading at the 2018 TDK Developers Conference.   The 2018 TDK Developers Conference registration website is now open! This year’s conference will inspire Developers/Engineers/Partners/Customers with “TDK’s Portfolio of Solutions” bringing together market leaders, executives, senior engineers,Read More
TDK-InvenSense-1
EOL Notification for MPU-9250, MPU-9250M, MPU-9255   PCN Notification Date Aug 17, 2018 Subject EOL notice for MPU-9250, MPU-9250M, MPU-9255. Products Affected MPU-9250, EV_MPU-9250, FF_MPU-9250, MPU-9250M, MPU-9255, SB_10_Demo Reason For Change As part of TDK’s on-going product lifecycle management process, the MPU-9250, MPU-9250M, and MPU-9255 will be discontinued. There are 3rd party components on these chips that have been obsoleted. Please contact your local Sales office for alternative options. Description of Change Product discontinuance notice for MPU-9250, MPU-9250M, MPU-9255. Impact of Change Due to the discontinuance of 3rd party components,Read More
Invensense-TN
Humanizing The Digital Experience TDK Developers Conference September 17-18, 2018 Santa Clara Marriot, USA Now with Keynotes from Qualcomm and HTC; Panelists include, Google, Intel, Microsoft and more… Are you on the development team engineering products which include MEMS, Actuators, Microphones, Haptics, Temperature, or TOF sensors? Then you need to come to this event! The 2018 TDK Developers Conference registration website is now open! This year’s conference will inspire Developers/Engineers/Partners/Customers with “TDK’s Portfolio of Solutions” bringing together market leaders, executives, senior engineers, and the media, to learn about market advancements,Read More
Sensata-FI
Sensata Technologies 100CP2 Series of Sensors for Drinkable Water Applications Sensata Technologies has been a leading global supplier of pressure sensors for over 50 years. The 2CP series of pressure transducers has many versions, but one not so well know version is the 100CP2 Series. The 100CP2 Series of sensors are made to work in drinkable water applications.  Based on the ever popular 2CP series of pressure sensors, the 100CP2 Series come in many versions. The three most popular include: 100CP2-71-121, 0-15 psia 100CP2-71-127, 0-150 psig 100CP2-71-74, 0-250 psig ThisRead More
FI-TDK

Posted On May 30, 2018By Component Distributors Inc.In Ewave, Sensors and Wireless, TDK InvenSense

TDK InvenSense Offers New Development Kits

TDK InvenSense Offers New Development Kits InvenSense recently announced its TDK SmartMotion Platform; a comprehensive development kit for InvenSense Motion Sensor devices. The platform is designed around a Microchip SAMG55 MCU and can be used by any sensor developer/engineer for rapid evaluation and development of InvenSense sensor-based solutions. With a Total of 6 Different Development Kits Now Available: Part #: Image: Description: DK-10100 (NEW) Altimeter/Barometer, Capable Up to 3 Inches (a typical stair height) DK-20602 6-Axis, None DMP DK-20648 6-Axis, DMP Based Motion Sensing DK-20680A (NEW) Automotive Grade Motion SensorRead More
EM-FI
EOL for EM Microelectronic EMBC02 Proximity Sensor Announcing EMBC22 Replacement Part   If you have purchased the EM Microelectronic EMBC02 proximity sensor, Component Distributors wants to pass on to you that EM Microelectronic is officially announcing the End of Life (EOL) for the EMBC02 (full part number EMBC02-F403-H1000) from its product offering. Component Distributors currently has about 250 pcs in stock, and the last time to purchase the product will be June 15, 2018. After this date the EMBC02 will only be sold until all inventory is gone. However, theRead More
MegaChips-2
MegaChips – EOL eDSP (MA6000 Sensor Fusion Product & Evaluation Board) Effective immediately, MegaChips USA has decided to remove the eDSP (the MA6000 sensor fusion product and evaluation board) product line from their product offer. All product has been returned to the vendor and Component Distributors does not have any stock of this product. If you require a contact at MegaChips, please feel free to contact your local Component Distributor’s sales person for details. Component Distributors, Inc. (CDI) www.cdiweb.com Click Here to Submit a Technical Inquiry Toll-Free: 1-800-777-7334Read More
TDK-FI

Posted On May 15, 2018By Component Distributors Inc.In Ewave, Sensors and Wireless, TDK InvenSense

TDK InvenSense End of Life (EOL) for the INMP-441

TDK InvenSense End of Life (EOL) for the INMP-441 (and all variants) MEMS Microphone TDK InvenSense has announced the End of Life (EOL) for the INMP-441 (and all variants) MEMS Microphone. The reason for EOL is due to assembly partner production and test equipment limitation. Component Distributors Inc. currently has some of the INMP-441ACEZ devices in stock, approximately 2500 pcs. When these devices are gone, no more will be available. Please click here for more information regarding the official EOL notice. A possible replacement part is the ICS-43434 Microphone. InRead More