Sensors and Wireless Category

TE-FI

Posted On November 15, 2018By Component Distributors Inc.In Ewave, Sensors and Wireless, TE Connectivity

M3200 Pressure Transducer from TE Connectivity at CDI

M3200 Pressure Transducer from TE Connectivity at CDI   M3200 Series at CDI Download Data Sheet TE offers the M3200, the latest in a long line of pressure sensors designed and manufactured using our Microfused™ technology which is ideally suited for HVAC and refrigeration systems. While a range of board mount pressure sensors are used in HVAC systems for filter monitoring as well as pressure monitoring throughout a forced air system, the bulk of the pressure sensing is accomplished using heavy duty pressure sensors to monitor refrigerant pressure in compressor-basedRead More
ELVR-Series
All Sensors ELVR Analog and Digital Low Pressure Sensor Series   ELVR Series at CDI Download the Datasheet All Sensors introduces the ELVR series of pressure sensors for monitoring pressure ranges from +1 inch water to +30 inches of water. The ELVR sensors can communicate directly with microcontrollers, eliminating the need for additional A/D converters. Product highlights include an I2C or SPI interface, an analog 0.5 to 4.5V output signal, and significantly reduced position sensitivity. Operating at a low supply voltage (3V or 5V), the ELVR series is well suitedRead More
SGX-FI
Introducing the NEW NGM_1 SGX Sensortech Battery Operated Module for Natural Gas Detection   Click Here to Find the NGM_1 at CDI Download the NGM_1 Data Sheet Natural Gas Module Application Note The NEW NGM_1 from SGX Sensortech is a natural gas module, battery operated detection device designed for detection of natural gas (methane) in concentrations below 100% LEL (4.4% CH4 in air). This module is not suitable for propane and butane detection. The sensor is equipped with a test button as well as an audible alarm option realized withRead More
Linx-FI
CER Series Ceramic LTE Chip Antenna from Linx Technologies The CER Series Ceramic LTE Chip Antenna from Linx Technologies is a compact, high-efficiency antenna designed to be easily integrated into wireless telecommunication devices. Operating in all common 4G/3G/2G LTE bands, it has better efficiency and gain at lower cellular bands compared to competitive products, providing enhanced performance for NB-IoT (Narrow Band Internet of Things) and CAT-M1 applications.   CER Series Ceramic LTE Chip Antennas at CDI ANT-LTE-CER-B (Supplied in Cut Tape) ANT-LTE-CER-T (Tape and Reel of 450 pieces) AEK-LTE-CER (EvaluationRead More
Linx-Technologies-FI
Component Distributors, Inc. is Excited to Serve as a Franchised Distribution Partner for Linx Technologies in North America     Linx Technologies a Merlin, OR based developer and manufacturer of antennas is pleased to announce that Component Distributors, Inc. (CDI) is the newest distributor of Linx solutions. Focused on RF, Microwave, and wireless solutions, CDI delivers technical solutions that are easy to find and easy to buy, providing customers and supplier partners with design services, web commerce enablement and flexible supply chain solutions. “We’re very excited to welcome CDI asRead More
TE-Connectivity-FI

Posted On September 11, 2018By Component Distributors Inc.In Ewave, Sensors and Wireless, TE Connectivity

TE Connectivity, Model 64X Accelerometer

TE Connectivity, Model 64X Accelerometer Next Generation Crash Accelerometer Advanced Piezoresistive MEMS Sensor   TE Connectivity introduces the Model 64X, the most advanced accelerometer ever released for anthropomorphic dummy instrumentation. The accelerometer features a full bridge output configuration with an advanced damping for excellent shock survivability and flat frequency response to 7kHz. The model 64X accelerometer has a standard cross-talk accuracy of <2%, a standard ZMO of <±20mV and a linearity accuracy specification of <±0.70%. The model 64X accelerometer is offered in ranges from ±200 to ±2000g and has distinctRead More
NovaSensor-FI
NPX Product End of Life (EOL)   Subject: NPX Product End of Life (EOL) From: Robert Burgess Date: 7/27/18 To Whom It May Concern, This letter is to notify you that Amphenol Advanced Sensors has been given an Allocated EOL (end of life) notification by our ASIC supplier for a critical component used in this product. Our supplier has stated they will accept orders until August 24, 2018. Therefore, we are notifying all of our customers that use this product today to make any last time purchases on or beforeRead More
FI-TDK-InvenSense
Come Talk to Qualcomm, Microsoft, Intel, Oculus, and TDK about your Development Needs     Only 10 days left for you to sign up and discuss all of your Sensor Development needs! Come personally meet leaders in the industry, and have your questions answered and find out where the future of sensor development is heading at the 2018 TDK Developers Conference.   The 2018 TDK Developers Conference registration website is now open! This year’s conference will inspire Developers/Engineers/Partners/Customers with “TDK’s Portfolio of Solutions” bringing together market leaders, executives, senior engineers,Read More
TDK-InvenSense-1
EOL Notification for MPU-9250, MPU-9250M, MPU-9255   PCN Notification Date Aug 17, 2018 Subject EOL notice for MPU-9250, MPU-9250M, MPU-9255. Products Affected MPU-9250, EV_MPU-9250, FF_MPU-9250, MPU-9250M, MPU-9255, SB_10_Demo Reason For Change As part of TDK’s on-going product lifecycle management process, the MPU-9250, MPU-9250M, and MPU-9255 will be discontinued. There are 3rd party components on these chips that have been obsoleted. Please contact your local Sales office for alternative options. Description of Change Product discontinuance notice for MPU-9250, MPU-9250M, MPU-9255. Impact of Change Due to the discontinuance of 3rd party components,Read More
Invensense-TN
Humanizing The Digital Experience TDK Developers Conference September 17-18, 2018 Santa Clara Marriot, USA Now with Keynotes from Qualcomm and HTC; Panelists include, Google, Intel, Microsoft and more… Are you on the development team engineering products which include MEMS, Actuators, Microphones, Haptics, Temperature, or TOF sensors? Then you need to come to this event! The 2018 TDK Developers Conference registration website is now open! This year’s conference will inspire Developers/Engineers/Partners/Customers with “TDK’s Portfolio of Solutions” bringing together market leaders, executives, senior engineers, and the media, to learn about market advancements,Read More