 Andon Rollerball™ Sockets available at CDI eliminate many problems inherent in the shipping and assembly of conventional BGA sockets. The unique design also improves performance characteristics and reduces expensive rework and scrap while increasing production yields.
The key to Andon’s new design is a radiused hole at the bottom of the terminal. The terminal is then crimped over the solder ball beyond its hemisphere to encapsulate the solder ball, leaving just enough of the solder ball exposed to provide sufficient solder for soldering to a PCB.
With Andon’s Rollerball™ Socket design, the critical distance between the terminal and the PCB pad is typically reduced from .036"-.04" to .018"-.022". The solder becomes part of the "anchor" cross section and provides additional mechanical strength to the connection as well as the improved electrical connectivity. |
